Senior FA Engineer

About the role

NXP is looking for a Senior FA Engineer in Kuala Lumpur. The role uses a wide range of sample preparation techniques and imaging tools to perform package-level electrical FA (EFA) and die-level physical FA (PFA), and contributes to developing new FA techniques and tool evaluations.

Key responsibilities

• Use sample preparation techniques such as chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX and backside IR.
• Operate precision milling/polishing and RIE systems for site-specific sample preparation for EFA and PFA.
• Perform die extraction for various package types and carry out layer-by-layer polishing at the die level.
• Prepare samples by grinding/polishing, chemical processing and repackaging.
• Document analysis results with detailed observations, conclusions and recommended corrective actions.
• Contribute to developing new FA techniques, methodologies and recipes, and to tool evaluation projects supporting emerging technologies.

Required profile

• Bachelor's or Master's degree in Materials Science, Physics, Analytical Chemistry or a related field.
• Proven experience of more than 3 years in a semiconductor manufacturing or R&D environment; wafer fab experience is a plus.
• Strong understanding of semiconductor manufacturing processes.

Required skills

• Hands-on experience with a broad range of FA sample preparation tools and techniques.
• Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.