Die Attach Equipment Technician

About the role

NXP is looking for an experienced Die Attach Equipment Technician in Kuala Lumpur who can work independently to maintain and repair the Die Attach integrated line, including loader, unloader, die attach, AOI and reflow oven equipment. The technician must have semiconductor assembly equipment experience and strong troubleshooting skills so that equipment performance meets department OEE and MTBA/MTBF goals.

Key responsibilities

• Maintain and repair the Die Attach integrated line equipment, including loader, unloader, die attach, AOI and reflow oven.
• Perform equipment setup or conversion for product changes on the Die Attach line.
• Identify, sustain, purchase and find second sources for critical spare parts and tooling.
• Improve overall OEE, MTBA/MTBF, preventive maintenance effectiveness and reduce unscheduled downtime.
• Address root causes of problems and solve quality issues caused by the machine.
• Support production to meet weekly schedule targets, including weekends and public holidays, and manage maintenance activities and spare part fabrication.

Required profile

• Diploma in Electrical & Electronics or Mechanical Engineering, or a certificate with at least 5 years of relevant experience in Die Attach equipment.
• Experience in semiconductor assembly; applied statistics experience is an advantage.
• Good technical skills on front-end and back-end assembly equipment.
• Familiarity with the semiconductor production environment and process handling.
• Willingness to work long hours and shifts, and adherence to NXP's Total Quality Mindset, safety awareness and core values.

Required skills

• Strong troubleshooting skills and equipment knowledge.
• Good decision-making and problem-solving skills.
• Strong interpersonal and communication skills.